Shenzhen Winsin Electronic Co., Ltd.
Main products:Mobile Power Bank,Tablet PC,LCD Panel,BGA Chips,CPU Plastic Cover
Products
Contact Us
  • Contact Person : Mr. Li Yong
  • Company Name : Shenzhen Winsin Electronic Co., Ltd.
  • Tel : 86-755-33280021,15112647705
  • Fax : 86-755-33280029
  • Address : Guangdong,Shenzhen,Changfa West Rd 43#,Bantian,Longgang District
  • Country/Region : China
  • Zip : 518129

0.3MM Solder Balls For BGA Reballing 250Kpcs Lead Free

0.3MM Solder Balls For BGA Reballing 250Kpcs Lead Free
Product Detailed
0.3mm Solder Balls For BGA Reballing 1.Size:0.3mm 2.Lead free(Sn96.5Ag3Cu0.5) 3.Qty:250Kpcs per bottle 4.Original new

Original New 0.30mm Solder Balls For BGA Reballing 250Kpcs Lead free(PB without) 

1.Size:0.25mm2.Lead-free( Sn96.5Ag3Cu0.5)3.250k per bottle4.PMTC original 

5.Easy reballing

6.Heat directly

We can provide all size of BGA Solder Balls Leaded & Lead Free for BGA Reballing from 0.3mm to 0.76mm.Also,we can supply all other laptop repair parts and tools,welcome to order.

0.3MM Solder Balls For BGA Reballing 250Kpcs Lead Free



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